低压注塑是将奥燊Austromelt®聚酰胺热熔胶低压注塑填满模具，对电子元器件进行封装保护，注塑过程中不会对电子元器件造成损害。

Waterproofing Electronics (IP 67)

Our Adhesive compounds allow us to achieve IP 67 rated protection resulting in robust, waterproof solutions for PCB’s, sensors and smart connectors. IP67 is protection against dust and the effects of immersion – some of our molded products actually operate thousands of feet below the surface of the ocean.

Impact & Vibration

When the molding material cools, it hardens to a durometer of approximately 90 Shore A. This provides  molded component with very good protection against impact and vibration. All connectors, soldered components and wires are encapsulated and held in place within the material. This is very effective for the automotive industry, military and technology industries where motion, vibration and impact is a concern.

Strain Relief

The same over-mold materials used to encapsulate and suspend components within a semi-rigid shape allows flexibility when correctly engineered to allow proper movement for cables exiting the over-mold. The technology industry, as well as any industry using cables or wires, such as Auto, Medical and Military, can utilize low pressure molding to incorporate grommets and create strain relief.

Temperature Range

Austromelt® adhesive thermoplastic materials provide electronics protection in environments where changes in temperature are a concern. Working temperature typically is -40° to 250°C.