What molding material do you use for your LPM process?
We use Austromelt® High Performance Polyamide and Polyolefin Adhesives. They are thermoplastic materials that solidify simply by cooling down. They do not cross-link or release any toxic fumes. These molding materials offer strong adhesive properties and they are designed specifically for insert molding of electronics.

What are the advantages of using these materials?
We often replace Epoxy potting of electronics. Low Pressure Molding is a faster and more efficient process. With LPM we can  molding material around your product. This gives us a shorter cycle time and saves raw material at the same time. It also eliminates the housing otherwise needed to contain the potting material. Our Polyamide molding material simply “becomes the housing”. Low injection pressure allows us to gently mold around fragile components. This technology offers a good solution when standard high injection pressure causes high scrap rates.

Are you capable of competing with Europe and the United States?

Yes!  We have customers as far away as canada.

Is your molding material RoHS and REACH compliant?

YES!